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Mena kaore i te whakaatuhia to waahi, tohua tetahi o nga e whai ake nei:

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  1. Whare
  2. Nga Hua
  3. DRAM
  4. LPDDR4
  5. K4F4E3S4HF-GFCJ

Samsung Semiconductor - K4F4E3S4HF-GFCJ

KEY Part #: K7359761

[14653Stock Ngahau]

    Te waahanga waahanga:
    K4F4E3S4HF-GFCJ
    Kaihanga:
    Samsung Semiconductor
    Whakaahuatanga Taipitopito:
    4 Gb x32 3733 Mbps 1.8 / 1.1 / 1.1 V -40 ~ 95 °C 200FBGA Mass Production.
    Ko te wa kaiarahi paerewa a te kaihanga:
    I roto i te taonga
    Te whare noho:
    Kotahi Tau
    Chip Mai:
    Hong Kong
    RoHS:
    Te tikanga utu:
    Te ara kaipuke:
    Ngā Kāwai Whānau:
    KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: LPDDR5, DDR4, HBM Aquabolt, HBM Flarebolt, DDR3, GDDR6, MODULE and LPDDR4X ...
    Whakapai Tinana:
    We specialize in Samsung Semiconductor K4F4E3S4HF-GFCJ electronic components. K4F4E3S4HF-GFCJ can be shipped within 24 hours after order. If you have any demands for K4F4E3S4HF-GFCJ, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4F4E3S4HF-GFCJ Nga Hua Hua

    Te waahanga waahanga : K4F4E3S4HF-GFCJ
    Kaihanga : Samsung Semiconductor
    Whakaahuatanga : 4 Gb x32 3733 Mbps 1.8 / 1.1 / 1.1 V -40 ~ 95 °C 200FBGA Mass Production
    Toa : DDR3
    kiato : 4 Gb
    Org. : x32
    tere : 3733 Mbps
    ngaohiko : 1.8 / 1.1 / 1.1 V
    Temp. : -40 ~ 95 °C
    mōkī : 200FBGA
    Tūnga hua : Mass Production

    Nga Pūrongo Hou

    An Exclusive Look Inside Samsung’s Memory Exhibit at MWC
    Samsung Now Producing Four Gigabit LPDDR3 Mobile DRAM, Using 20nm-class Process Technology
    Evolving Mobile Solutions: Samsung at MWC 2018
    Samsung Z-SSD SZ985
    Samsung’s Newest ISOCELL Image Sensor Enables Mobile Devices to ‘Slow Down’ Time
    Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI
    Samsung Electronics Starts Mass Producing Industry’s First 8-Gigabit Graphics DRAM (GDDR5)
    [Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions
    Samsung Enhances Functional Safety to its Automotive Semiconductors with ISO 26262 Certification
    Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
    Driving the Artificial Intelligence Evolution with In-Memory Computing
    Unlocking the Power of Cloud Computing
    Kia Korero Ma Te Korero
    • M392A2K43BB0-CPB

      Samsung Semiconductor

      DDR4 VLP RDIMM 16 GB 2R x 8 2133 Mbps 1.2 V 288 (1G x 8) x 18 EOL.

    • M392A2K43BB0-CRC

      Samsung Semiconductor

      DDR4 VLP RDIMM 16 GB 2R x 8 2400 Mbps 1.2 V 288 (1G x 8) x 18 EOL.

    • M392A4K40BM0-CPB

      Samsung Semiconductor

      DDR4 VLP RDIMM 32 GB 2R x 4 2133 Mbps 1.2 V 288 (DDP4G x 4) x 18 EOL.

    • M392A4K40BM0-CRC

      Samsung Semiconductor

      DDR4 VLP RDIMM 32 GB 2R x 4 2400 Mbps 1.2 V 288 (DDP4G x 4) x 18 EOL.

    • M378A1K43BB1-CPB

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2133 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

    • M378A1K43BB2-CRC

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2400 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

    Nga Wahanga Panu